Eco-friendly Etching Process
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¿Â½ÇÈ¿°ú °¨ÃàÀ» À§ÇÑ ¹ÝµµÃ¼/µð½ºÇ÷¹ÀÌ Á¦Á¶°øÁ¤ÀÇ PFC ´ëü ½Ä°¢°øÁ¤ °³¹ß ½Ä°¢ ¸ÞÄ¿´ÏÁò°ú Ç¥¸éÇö»ó ±Ô¸íÀ» ÅëÇÑ ½Ä°¢¼Óµµ °¢µµÀÇÁ¸¼º È®º¸ ¹× ½Ä°¢°øÁ¤ ÃÖÀûÈ ½Ä°¢°øÁ¤ ¹× °ü·Ã¿ä¼Ò ±â¼ú °³¹ßÀ» ÅëÇÑ ½Ä°¢ µ¥ÀÌÅͺ£À̽º È®º¸
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Flexible Electrode-based LED-plasma System for Sterilization and Theraphy
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Àú¿Â ´ë±â¾Ð ÇöóÁ ±â¼úÀÇ »ýÀÇÇÐ ºÐ¾ß Àû¿ë »ì±Õ ¹× »óóġ·á°¡ °¡´ÉÇÑ À¯¿¬Àü±Ø ±â¹ÝÀÇ ÇöóÁ ½Ã½ºÅÛ °³¹ß ´Ù¾çÇÑ Çü»óÀÇ Àü±Ø ±³Ã¼°¡ °¡´ÉÇÑ FE-DBD ±â¹Ý ÀÇ·á¿ë ÇöóÁ ±â±â °³¹ß °øÁ¤º¯¼ö¿Í ÇöóÁ ³»ºÎ º¯¼ö¿ÍÀÇ »ó°ü°ü°è ±Ô¸íÀ» ÅëÇÑ »ì±Õ ¹× »óóġ·á Ư¼º Çâ»ó
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Multi-cyclic Plasma Etching for the Reduction in the Diameter of Contact Holes with a High Anisotropy and Aspect Ratio
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°íÁ¾È¾ºñ ºñµî¹æ¼º ÄÁÅÃȦ ½Ä°¢Çü»óÀ» ±¸ÇöÇÏ´Â ´ÙÁß¼øÈ¯ ÇöóÁ ½Ä°¢±â¼ú °³¹ß ´ÙÁß¼øÈ¯ ÇöóÁ ½Ä°¢±â¼úÀ» ÅëÇÑ ÃÖ¼Ò¼±ÆøÀ» °¨¼Ò½Ãų ¼ö ÀÖ´Â ±â¼ú È®º¸ ÃÖ¼Ò¼±Æø °¨¼Ò¸¦ ÅëÇÑ DRAM, Flash Memory, Fin-FET, TSV µîÀÇ ¹ÝµµÃ¼ ¼ÒÀÚ ÁýÀûµµ Çâ»ó
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Multi-Directional Slanted Plasma Etching for the Templateless Direct Patterning of 3-dimensional High Aspect Ratio Microfeatures
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¹ÝµµÃ¼, ±¤¼ÒÀÚ µî ´Ù¾çÇÑ ºÐ¾ß¿¡ Àû¿ë °¡´ÉÇÑ 3Â÷¿ø ¹Ì¼¼±¸Á¶¹°ÀÇ Templateless Direct Patterning ±â¼úÀÇ È®º¸ ´Ù¾çÇÑ °¢µµ¿Í °íÁ¾È¾ºñ¸¦ ±ÕÀÏÇÏ°Ô °®´Â °æ»ç±¸Á¶¹°ÀÇ ´Ù¹æÇâ °æ»ç ÇöóÁ ½Ä°¢±â¼ú °³¹ß ´Ù¹æÇâ °æ»ç ÇöóÁ ½Ä°¢À¸·Î Çü¼ºµÈ °íÁ¾È¾ºñ °æ»ç±¸Á¶¹°ÀÇ ½Ä°¢ ¸ÞÄ¿´ÏÁò ±Ô¸í ¹× ½Ä°¢ ÇÁ·ÎÆÄÀÏ Á¶Àý °æ»çÇüÅ ÆÐÅÏÀ» Áö´Ñ 3Â÷¿ø ¹Ì¼¼±¸Á¶¹°ÀÇ Templateless Direct Patterning ½Ã½ºÅÛ ±¸Ãà ´Ù¹æÇâ °æ»ç ÇöóÁ ½Ä°¢¿¡ ÀûÇÕÇÑ ÇöóÁ ¼Ò½ºÀÇ °³¹ßÀ» ÅëÇÑ ÇöóÁ ÀÌ·ÐÀû ¹ßÀü
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