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1.
Sanghyun You, Eun Jae Sun, Yujeong Hwang, and Chang-Koo Kim,
¡°Heptafluoroisopropyl Methyl Ether as a Low Global Warming Potential
Alternative for Plasma Etching of SiC¡±, Korean Journal of Chemical
Engineering, 41, pp. 1307-1310 (2024 February 5).
2. Sanghyun
You, Hyun Seok Yang, Dongjun Jeon, Heeyeop Chae, and Chang-Koo Kim,
¡°Controlling Bowing and Narrowing in SiO2 Contact-Hole Etch Profiles
Using Heptafluoropropyl Methyl Ether as an Etchant with Low Global
Warming Potential¡±, Coatings, 13(8), pp. 1452-1458 (2023, August 16)
3.
Sungun Kang, Chul-Ho Kim, Sanghyun You, Da-Young Lee, Yu-Kwon Kim,
Seung-Joo Kim, Chang-Koo Kim and Hee-Kyung Kim, ¡°Plasma Surface
Modification of 3Y-TZP at Low and Atmospheric Pressures with Different
Treatment Times¡±, International Journal of Molecular Sciences, 24,
pp.7663-7679 (2023, February 14).
4. Yongjae Kim, Seoeun Kim,
Hojing Kang, Sanghyun You, Chang-Koo Kim, and Heeyeop Chae, ¡°Low Global
Warming C4H3F7O Isomers for Plasma Etching of SiO2 and Si3N4 Films¡±,
ACS SUSTAINABLE CHEMISTRY & ENGINEERING, 10, pp.10537-10546 (2022,
August 1).
5. Yongwoo Jang, Junsoo Bok, Dong Keun Ahn, Chang-Koo
Kim, and Ju-Seop Kang, ¡°Human Trial for the Effect of Plasma-Activated
Water Spray on Vaginal Cleaning in Patients with Bacterial Vaginosis¡±,
Medical Science, 10, pp.331-339 (2022, June 18).
6. Sanghyun
You, Yu Jong Lee, Heeyeop Chae, and Chang-Koo Kim, ¡°Plasma Etching of
SiO2 Contact Holes Using Hexafluoroisopropanol and C4F8¡±, Coatings, 12,
pp.6791-6798 (2022, May 16).
7. Jun-Hyun Kim, Sanghyun You,
Chang-Koo Kim, ¡°Plasma etching of SiO2 contact hole using
perfluoropropyl vinyl ether and perfluoroisopropyl vinyl ether¡±, Korean
Journal of Chemical Engineering, 39, pp.63-68 (2022, January 6)
8.
Jun-Hyun Kim, Sanghyun You, Chang-Koo Kim, ¡°Surface Texturing of Si
with Periodically Arrayed Oblique Nanopillars to Achieve
Antireflection¡±, Materials, 14, pp.3801-3809 (2021, January 14)
9.
Jun-Hyun Kim, Jin-Su Park, Chang-Koo Kim, ¡°SiO2 etching in inductively
coupled plasmas using heptafluoroisopropyl methyl ether and
1,1,2,2-tetrafluoroethyl 2,2,2-trifluoroethyl ether¡±, Applied Surface
Science, 508, pp.144787-1-144787-8 (2020, April 1)
10.
Jeong-Guen Bak, Jun-Hyun Kim, Chang-Koo Kim, ¡°Electrical resistivity of
Ni–Fe wires coated with Sn using low-pressure chemical vapor
deposition¡±, Coatings, 10, pp.317-1 -317-9 (2020, March 27)
11.
Jun-Hyun Kim, Chang-Koo Kim, ¡°Si3N4 etch rates at various ion-incidence
angles in high-density CF4, CHF3, and C2F6 plasmas¡±, Korean Journal of
Chemical Engineering, 37, pp.374-379, (2020, January 30)
12.
Jun-Hyun Kim, Jin-Su Park, Yong-Seon Shin, Chang-Koo Kim,
¡°Atmospheric-pressure floating electrode-dielectric barrier discharge
with flexible electrodes: Effect of conductor shapes¡±, Korean Journal
of Chemical Engineering, 36, pp.1371-1376 (2019, July 31)
13.
Jin-Su Park, Suhyun Kim, Jun-Hyun Kim, Chang-Koo Kim, and Jihyun Kim,
"Auto-masked texturing of kerf-loss free silicon wafers using
hexafluoroisopropanol in a capacitively coupled plasma etching system",
ECS Journal of Solid State Science and Technology, 8, pp.Q76-Q79 (2019,
May 13).
14. Jun-Hyun Kim, Jin-Su Park, Chang-Koo Kim, ¡°Angular
dependence of SiO2 etching in plasmas containing heptafluoropropyl
methyl ether¡±, Thin Solid Films, 669, pp.262-268 (2019, January 1).
15.
Jun-Hyun Kim, Jin-Su Park, Chang-Koo Kim, ¡°Plasma etching of SiO2 using
heptafluoropropyl methyl ether and perfluoropropyl vinyl ether¡±, ECS
Journal of Solid State Science and Technology, 7, pp.Q218-Q221 (2018,
November 17).
16. Hyemin Lee, Jun-Hyun Kim, Gaoxiang Wu, Hae-Min
Lee, Jaekyoung Kim, Dokyeong Kwon, Shu Yang, Chang-Koo Kim, and Hyunsik
Yoon, ¡°Clustering and self-recovery of slanted hydrogel micropillars¡±,
Advanced Materials Interfaces, 5, pp.1801142 (2018, October 17).
17.
Suhyun Kim, Jun-Hyun Kim, Jihyun Kim, and Chang-Koo Kim, ¡°Reducing the
optical reflectance of kerf-loss free silicon wafers via auto-masked
CF4/O2 plasma etch¡±, ECS Journal of Solid State Science and Technology,
7, pp.Q88-Q91 (2018, May 16).
18. Sooyeoun Oh, Chang-Koo Kim,
Jihyun Kim, ¡°High responsivity ¥â-Ga2O3 metal-semiconductor-metal
solar-blind photodetectors with ultra-violet transparent graphene
electrodes¡±, ACS Photonics, 5, pp.1123-1128 (2018, March 21).
19.
Jun-Hyun Kim, Jeong Geun Bak, Kangtaek Lee, Chang-Koo Kim, ¡°Control of
the electrical resistivity of Ni-Cr wires using low pressure chemical
vapor deposition of tin¡±, Applied Surface Science, 429, pp.134-137
(2018, January 31).
20. Kyongbeom Koh, Yongjae Kim, Chang-Koo
Kim, and Heeyeop Chae, ¡°Quasi Atomic Layer Etching of SiO2 using
Surface Fluorination for Surface Cleaning¡±, Journal of Vacuum Science
and Technology A, 36, pp.01B106-1-5 (2018, January 1).
21.
Jun-Hyun Kim, Sung-Woon Cho, and Chang-Koo Kim, ¡°Angular dependence of
Si3N4 etching in C4F6/CH2F2/O2/Ar plasmas¡±, Chemical Engineering &
Technology, 40, pp.2251-2256 (2017, December 1).
22. Jun-Hyun
Kim, Sung-Woon Cho, Chang Jin Park, Heeyeop Chae, Chang-Koo Kim,
¡°Angular dependences of SiO2 etch rates at different bias voltages in
CF4, C2F6, and C4F8 plasmas¡±, Thin Solid Films, 637, pp.43-48 (2017,
September 1).
23. Hae-Min Lee, Gyoung Hwa Jeong, Sang-Wook Kim,
Chang-Koo Kim, ¡°Low-temperature direct synthesis of mesoporous vanadium
nitrides for electrochemical capacitors¡±, Applied Surface Science, 400,
pp.194-199 (2017, April 1).
24. Haegyu Jang, Hakseung Lee,
Honyoung Lee, Chang-Koo Kim, Heeyeop Chae, ¡°Sensitivity enhancement of
dielectric plasma etching endpoint detection by optical emission
spectra with modified K-means cluster analysis¡±, IEEE Transactions on
Semiconductor Manufacturing, 30, pp.17-22 (2017, February 1).
25.
Sung-Woon Cho, Jun-Hyun Kim, Hae-Min Lee, Heeyeop Chae, Chang-Koo Kim,
¡°Superhydrophobic Si surfaces having microscale rod structures prepared
in a plasma etching system¡±, Surface & Coatings Technology, 306,
pp.82-86 (2016, November 25).
26. Sung-Woon Cho, Hae-Min Lee,
Jun-Hyun Kim, Jeong Geun Bak, Chang-Koo Kim, ¡°Fabrication of Slanted Cu
Nanopillars with Uniform Arrays¡±, Nanomaterials and Nanotechnology, 6,
pp.1-5 (2016, March 1).
27. Jun-Hyun Kim, Sung-Woon Cho, Doo Won
Kang, Kyung Mi Lee, Chang Yong Baek, Hae-Min Lee, and Chang-Koo Kim,
¡°Electrical, structural, and morphological characteristics of
dopantless tin oxide films prepared by low pressure chemical vapor
deposition¡±, Science of Advanced Materials, 8, pp.117-121 (2016,
January 1).
28. Taegyeong Kang, Kiju Um, Jinmo Park, Hochan
Chang, Doh C. Lee, Chang-Koo Kim, Kangtaek Lee ¡°Minimizing the
fluorescence quenching caused by uncontrolled aggregation of CdSe/CdS
core/shell quantum dots for biosensor applications¡±, Sensors and
Actuators B: Chemical, 222, pp.871-878 (2016, January 1).
29.
Thanh-Truc Pham, Chinh Nguyen-Huy, Hyun-Jun Lee, Thuy-Duong
Nguyen-Phan, Tae Hwan Son, Chang-Koo Kim, and Eun Woo Shin, ¡°Cu-doped
TiO2/reduced graphene oxide thin-film photocatalysts: Effect of Cu
content upon methylene blue removal in water¡±, Ceramics International,
41 (9), pp.11184-11193 (2015, November 1).
30. Sung-Woon Cho,
Jun-Hyun Kim, Jeong Geun Bak, and Chang-Koo Kim, ¡°Fabrication of
uniformly arrayed single- and multi-directional slanted Cu nanorods¡±,
ECS Solid State Letters, 4 (11), pp.P85-P87 (2015, November 1).
31.
Sung-Woon Cho, Jun-Hyun Kim, Sangin Kim, Eun Woo Shin, and Chang-Koo
Kim, ¡°Reduction in the diameter of contact holes with a high anisotropy
and aspect ratio¡±, ECS Journal of Solid State Science and Technology, 4
(7), pp.P226-P231 (2015, July 1).
32. Thuy-Duong Nguyen-Phan,
Chinh Nguyen Huy, Chang-Koo Kim, and Eun Woo Shin, ¡°Facile
microwave-assisted synthesis and controllable architecture of
three-dimensional nickel titanate¡±, CrystEngComm, 17 (24), pp.4562-4574
(2015, June 28).
33. Hae-Min Lee, Gyoung Hwa Jeong, Doo Won
Kang, Sang-Wook Kim, Chang-Koo Kim, ¡°Direct and environmentally benign
synthesis of manganese oxide/graphene composites from graphite for
electrochemical capacitors¡±, Journal of Power Sources, 281, pp.44-48
(2015, May 1).
34. Hae-Min Lee, Sung-Woon Cho, Chan-Ju Song,
Heung Jung Kang, Bum Jin Kwon, Chang-Koo Kim, ¡°Abrupt change with
surfactant concentration in the surface morphology of the
electrodeposited manganese oxide films for electrochemical capacitors¡±,
Electrochimica Acta, 160, pp.50-56 (2015, April 1).
35. Chang
Yeong Jeong, Chang-Koo Kim and Sangin Kim, ¡°Slot-embedded
photonic-crystal resonator with enhanced modal confinement¡±, Optics
Letters, 40, pp.554-557 (2015, Feb. 15).
36. Sung-Woon Cho,
Jun-Hyun Kim, Doo Won Kang, Kangtaek Lee, and Chang-Koo Kim, ¡°Single-
and multi-directional slanted plasma etching of silicon under practical
plasma processing conditions¡±, ECS Journal of Solid State Science and
Technology, 3 (11), pp.Q215-Q220 (2014, November 1).
37. Gyoung
Hwa Jeong, Hae-Min Lee, Ji-goo Kang, Heewoong Lee, Chang-Koo Kim,
Jae-Hyeok Lee, Jae-Ho Kim, and Sang-Wook Kim, ¡°ZrO2-SiO2 nanosheets
with ultrasmall WO3 nanoparticles and their enhanced pseudocapacitance
and stability¡±, ACS Applied Materials & Interfaces, 6,
pp.20171-20178 (2014, October 27).
38. Gyoung Hwa Jeong, Hae-Min
Lee, Heewoong Lee, Chang-Koo Kim, Yuanzhe Piao, Jae-Hyeok Lee, Jae-Ho
Kim and Sang-Wook Kim, ¡°One-pot synthesis of thin Co(OH)2 nanosheets on
graphene and their high activity as a capacitor electrode¡±, RSC
Advances, 4, pp.51619-51623 (2014, October 7).
39. Hae-Min Lee,
Kangtaek Lee, and Chang-Koo Kim, ¡°Electrodeposition of manganese-nickel
oxide films on a graphite sheet for electrochemical capacitor
applications¡±, Materials, 7, pp.265-274 (2014, January 9).
40.
Haegyu Jang, Jaewook Nam, Chang-Koo Kim, and Heeyeop Chae, ¡°Real-time
endpoint detection of small exposed area SiO2 films in plasma etching
using plasma impedance monitoring with modified principal component
analysis¡±, Plasma Processes and Polymers, 10 (10), pp.850-856 (2013,
October 1).
41. S. Rajagopal, D. Nataraj, O. Y. Khyzhun, Yahia
Djaoued, Jacques Robichaud, and Chang-Koo Kim, ¡°Controlled synthesis of
MoO3 microcrystals by subsequent calcination of hydrothermally grown
pyrazine-MoO3 nanorod hybrids and their photodecomposition properties¡±,
Materials Chemistry and Physics, 141, pp.383-392 (2013, August 15).
42.
Cheolsang Yoon, Hyun-Guk Hong, Hyun Chang Kim, Daehyun Hwang, Doh C.
Lee, Chang-Koo Kim, Young-Joo Kim, Kangtaek Lee, ¡°High luminescence
efficiency white light emitting diodes based on surface functionalized
quantum dots dispersed in polymer matrices¡±, Colloids and Surfaces A:
Physicochemical and Engineering Aspects, 428, pp.86-91 (2013, Apr. 02).
43.
Sung-Woon Cho, Chang-Koo Kim, Jin-Kwan Lee, Sang Heup Moon, and Heeyeop
Chae, ¡°Angular dependences of SiO2 etch rates in C4F6/O2/Ar and
C4F6/CH2F2/O2/Ar plasmas¡±, Journal of Vacuum Science and Technology A,
30 (5), pp.051301-1 - 051301-6 (2012, July 3).
44. S. G.
Kandalkar, Hae-Min Lee, Seung Hye Seo, Kangtaek Lee, and Chang-Koo Kim,
¡°Cobalt-nickel composite films synthesized by chemical bath deposition
method as an electrode material for supercapacitors¡±, Journal of
Materials Science, 46 (9), pp.2977-2981 (2011, May 1).
45. S. G.
Kandalkar, Hae-Min Lee, Heeyeop Chae, and Chang-Koo Kim, ¡°Structural,
morphological, and electrical characteristics of the electrodeposited
cobalt oxide electrode for supercapacitor applications¡±, Materials
Research Bulletin, 46 (1), pp.48-51 (2011, Jan. 1).
46. S. G.
Kandalkar, D. S. Dhawale, Chang-Koo Kim, and C. D. Lokhande, ¡°Chemical
synthesis of cobalt oxide thin film electrode for supercapacitor
application¡±, Synthetic Metals, 160 (11-12), pp.1299-1302 (2010, June
1). 2.109
47. Minho Noh, Taehoon Kim, Hosub Lee, Chang-Koo Kim,
Sang-Woo Joo, and Kangtaek Lee, ¡°Fluorescence Quenching Caused by
Aggregation of Water-Soluble CdSe Quantum Dots¡±, Colloids and Surfaces
A: Physicochemical and Engineering Aspects, 359 (1-3), pp.39-44 (2010,
Apr. 20).
48. Jin-Kwan Lee, Il-Yong Jang, Seung-Haeng Lee,
Chang-Koo Kim, and Sang Heup Moon, ¡°Mechanism of sidewall necking and
bowing in the plasma etching of high aspect-ratio contact holes¡±,
Journal of the Electrochemical Society, 157 (3), pp.D142-D146 (2010,
Jan. 12). 2.588
49. Jin-Kwan Lee, Il-Yong Jang, Seung-Haeng Lee,
Chang-Koo Kim, and Sang Heup Moon, ¡°Cyclic deposition/etching process
to etch a bowing-free SiO2 contact hole¡±, Journal of the
Electrochemical Society, 156 (8), pp.D269-D274 (2009, Aug. 1). 2.588
50.
Jin-Kwan Lee, Seung-Haeng Lee, Jae-Ho Min, Il-Yong Jang, Chang-Koo Kim,
and Sang Heup Moon, ¡°Oblique-directional plasma etching of Si using a
Faraday cage¡±, Journal of the Electrochemical Society, 156 (7),
pp.D222-D225 (2009, Jul. 1). 2.588
51. Hae-Min Lee, Santosh K.
Mahapatra, John Kiran Anthony, Fabian Rotermund, and Chang-Koo Kim,
¡°Effect of titanium ion concentration on electrodeposition of
nanostructured TiNi films¡±, Journal of Materials Science, 44 (14),
pp.3731-3735 (2009, Jul. 15).
52. S. M. S. I. Dulal, Hyeong Jin
Yun, Chee Burm Shin, and Chang-Koo Kim, ¡°Electrodeposition of CoWP film
V. Structural and morphological characterisations¡±, Applied Surface
Science, 255 (11), pp.5795-5801 (2009, Mar. 15). 2.112
53.
Hyongmoo Rhee, Hae Min Lee, Yun Mi Namkoung, Chang-Koo Kim, Heeyeop
Chae, and Yil Wook Kim, ¡°Dependence of etch rates of silicon substrates
on the use of C4F8 and C4F6 plasmas in the deposition step of the Bosch
process¡±, Journal of Vacuum Science and Technology B, 27 (1), pp.33-40
(2009, Jan. 12).
54. S. M. S. I. Dulal, Tae Ho Kim, Hyongmoo
Rhee, Joon Yong Sung, and Chang-Koo Kim, ¡°Development of an
alkali-metal-free bath for electroless deposition of Co-W-P capping
layers for copper interconnections¡±, Journal of Alloys and Compounds,
467 (1-2), pp.370-375 (2009, Jan. 7).
55. Hyeong Jin Yun, S. M.
S. I. Dulal, Chee Burm Shin, and Chang-Koo Kim, ¡°Characterisation of
electrodeposited Co-W-P amorphous coatings on carbon steel¡±,
Electrochimica Acta, 54 (2), pp.370-375 (2008, Dec. 30). 3.777
56.
S. M. S. I. Dulal, Tae Ho Kim, Chee Burm Shin, and Chang-Koo Kim,
¡°Electrodeposition of CoWP film IV. Effect of applied potential and
current density¡±, Journal of Alloys and Compounds, 461 (1-2),
pp.382-388 (2008, Aug. 11). 2.390
57. John Kiran Anthony, Hee
Cheoul Kim, Hwang Woon Lee, S. Kumar Mahapatra, Hae Min Lee, Chang-Koo
Kim, Kihong Kim, Hanjo Lim, and Fabian Roterrmund, ¡°Particle
size-dependent giant nonlinear absorption in nanostructured Ni-Ti
alloys¡±, Optics Express, 16 (15), pp.11193-11202 (2008, Jul. 10). 3.546
58.
Tae Ho Kim, S. M. S. I. Dulal, Chang Han Park, Heeyeop Chae, and
Chang-Koo Kim, ¡°Optimisation of process parameters for electroless
plating of Co–W–P capping layers from an alkali-metal-free bath¡±,
Surface & Coatings Technology, 202 (19), pp.4861-4867 (2008, Jun.
25). 1.941
59. Hyongmoo Rhee, Hyeokkyu Kwon, Chang-Koo Kim,
HyunJung Kim, Jaisuk Yoo, and Yil Wook Kim, ¡°Comparison of deep silicon
etching using SF6/C4F8 and SF6/C4F6 plasmas in the Bosch process¡±,
Journal of Vacuum Science and Technology B, 26 (2), pp.576-581 (2008,
Mar. 28). 1.267
60. S. M. S. I. Dulal, Chee Burm Shin, Joon Yong
Sung, and Chang-Koo Kim, ¡°Electrodeposition of CoWP film II. Effect of
electrolyte concentration¡±, Journal of Applied Electrochemistry, 38
(1), pp.83-91 (2008, Jan. 1). 1.836
61. S. M. S. I. Dulal,
Hyeong Jin Yun, Chee Burm Shin, and Chang-Koo Kim, ¡°Electrodeposition
of CoWP film III. Effect of pH and temperature¡±, Electrochimica Acta,
53 (2), pp.934-943 (2007, Dec. 1). 3.777
62. S. M. S. I. Dulal,
Hyeong Jin Yun, Chee Burm Shin, and Chang-Koo Kim, ¡°Electrodeposition
of CoWP Film I. Electrochemical and Compositional Analyses¡±, Journal of
Electrochemical Society, 154 (10), pp.D494-D501 (2007, Oct. 1). 2.588
63.
Hyun-Kyu Ryu, Yil-Wook Kim, Kangtaek Lee, Chee Burm Shin, and Chang-Koo
Kim, ¡°A Comparative Study on a High Aspect Ratio Contact Hole Etching
in UFC-containing and PFC-containing Plasmas¡±, Microelectronics
Journal, 38 (1), pp.125-129 (2007, Jan. 1).
64. Jae-Ho Min,
Jin-kwan Lee, Sang Heup Moon, and Chang-Koo Kim, ¡°Interactive
Relationships between Sidewall and Bottom Etch Rates, As-affected by
Sidewall angle, during SiO2 Etching in a CHF3 Plasma¡±, Journal of
Vacuum Science and Technology B, 24 (4), pp.1746-1754 (2006, Jul. 1).
65.
Hyun-Kyu Ryu, Yil-Wook Kim, Chee Burm Shin, and Chang-Koo Kim, ¡°Effect
of Wafer Cleaning on the Interconnect Structure and Its Electrical
Properties during the Al Dual Damascene Process for the Fabrication of
Sub-100 nm Memory Devices¡±, Journal of Chemical Engineering of Japan,
38 (11), pp.922-928 (2005).
66. Jae-Ho Min, Jin-kwan Lee, Sang
Heup Moon, and Chang-Koo Kim, ¡°Deep Etching of Silicon with Smooth
Sidewalls by an Improved Gas-Chopping Process Using a Faraday Cage and
a High Bias Voltage¡±, J. Vac. Sci. Tech. B, 23 (4), pp.1405-1411 (2005).
67.
Jae-Ho Min, Gyeo-Re Lee, Jin-kwan Lee, Sang Heup Moon, and Chang-Koo
Kim, ¡°Effect of Sidewall Properties on the Bottom Microtrench during
SiO2 Etching in a CF4 Plasma¡±, J. Vac. Sci. Tech. B, 23 (2), pp.425-432
(2005).
68. Chang-Koo Kim and Chee Burm Shin, ¡°Plasma Molding
over Surface Topography: Measurement of Energy and Angular
Distributions of Ions Extracted through a Large Hole¡±, Thin Solid
Films, 475 (1-2), pp.24-31 (2005). 1.604
69. Jae-Ho Min, Gyeo-Re
Lee, Jin-kwan Lee, Chang-Koo Kim, and Sang Heup Moon ¡°Improvement
of SiO2 Pattern Profiles Etched in CF4 and SF6 Plasmas by Using a
Faraday Cage and Neutral Beams¡±, Surface and Coatings Technology, 193
(1-3), pp.75-80 (2005).
70. Zhijian Wu, Hyeonwoo Joo, Ik-Sung
Ahn, Jung-Hyun Kim, Chang-Koo Kim, and Kangtaek Lee, ¡°Design of Doped
Hybrid Xerogels for a Controlled Release of Brillant Blue FCF¡±, Journal
of Non-Crystalline Solids, 342, pp.46-53 (2004). 1.597
71.
Jae-Ho Min, Gyeo-Re Lee, Jin-kwan Lee, Sang Heup Moon, and Chang-Koo
Kim, ¡°Angular Dependence of Etch Rates in the Etching of Poly-Si and
Fluorocarbon Polymer Using SF6, C4F8, and O2 Plasmas¡±, J. Vac. Sci.
Tech. A, 22 (3), pp.661-669 (2004).
72. Jae-Ho Min, Gyeo-Re Lee,
Jin-kwan Lee, Sang Heup Moon, and Chang-Koo Kim, ¡°Dependences of Bottom
and Sidewall Etch Rates on Bias Voltage and Source Power during the
Etching of Poly-Si and Fluorocarbon Polymer Using SF6, C4F8, and O2
Plasmas¡±, J. Vac. Sci. Tech. B, 22 (3), pp.893-901 (2004).
73.
Hyun-Kyu Ryu, Byung-Seok Lee, Sung-Ki Park, Il-Wook Kim, and Chang-Koo
Kim, ¡°Effect of CH2F2 Addition on a High Aspect Ratio Contact Hole
Etching in a C4F6/O2/Ar Plasma¡±, Electrochemical and Solid-State
Letters, 6 (9), pp.C126-C129 (2003). 2.010
74. Chang-Koo Kim and
Demetre J. Economou, ¡°Plasma Molding over Surface Topography: Energy
and Angular Distribution of Ions Extracted out of Large Holes¡±, J.
Appl. Phys., 91 (5), pp.2594-2603 (2002). 2.210
75. Chang-Koo
Kim, A. Kubota and Demetre J. Economou, ¡°Molecular Dynamics Simulation
of Silicon Surface Smoothing by Low-Energy Argon Cluster Impact¡±, J.
Appl. Phys. 86 (12), pp.6758-6762 (1999).
76. Chang-Koo Kim,
Chang-Hwa Chung, and Sang Heup Moon, ¡°Suppression of Oxide Growth on
Porous Silicon by treatment with HF Vapor¡±, J. Appl. Phys. 78 (12),
pp.7392-7394 (1995).
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| Domestic Journal (SCI)
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1.
Jun-Hyun Kim, Jin-Su Park, Yong-Seon Shin, and Chang-Koo Kim,
""Atmospheric-pressure floating electrode-dielectric barrier discharge
with flexible electrodes: Effect of conductor shapes", Korean Journal
of Chemical Engineering, 36, pp.1371-1376 (2019, July 31).
2.
Jun-Hyun Kim, Hae-Min Lee, Doo Won Kang, Kyung Mi Lee, and Chang-Koo
Kim, ¡°Effect of oxygen flow rate on the electrical and optical
characteristics of dopantless tin oxide films fabricated by LPCVD¡±,
Korean Journal of Chemical Engineering, 33 (9), pp.2711-2715 (2016,
Sep. 1).
3. S. Rajagopal, Hae-Min Lee, Kangtaek Lee, and
Chang-Koo Kim, ¡°Hydrothermal synthesis of one-dimensional tungsten
oxide nanostructures using cobalt ammonium sulfate as a
structure-directing agent¡±, Korean Journal of Chemical Engineering, 30
(10), pp.1833-1835 (2013, Oct. 1).
4. Hae-Min Lee, Heeyeop Chae,
and Chang-Koo Kim, ¡°Electroless deposition of NiMoP films using
alkali-free chemicals for capping layers of copper interconnections¡±
Korean Journal of Chemical Engineering, 29 (9), pp.1259-1265 (2012,
Sep. 1).
5. Sunil G. Kandalkar, Hae-Min Lee, Seung Hye Seo,
Kangtaek Lee, and Chang-Koo Kim, ¡°Preparation and characterization of
the electrodeposited Ni-Co oxide thin films for electrochemical
capacitors¡±, Korean Journal of Chemical Engineering, 28 (6),
pp.1464-1467 (2011, Jun. 1).
6. Yun Mi Namkoung, Hae-Min Lee,
Young-Seon Son, Kangtaek Lee, and Chang-Koo Kim, ¡°Characteristics of
electrodeposited CoWP capping layers using alkali-metal-free
precursors¡±, Korean Journal of Chemical Engineering, 27 (5),
pp.1596-1600 (2010, Sep. 1).
7. Kitae Lee, Deokkyu Lee, Hosub
Lee, Chang-Koo Kim, Zhijian Wu, and Kangtaek Lee, ¡°Comparison of
amine-functionalized mesoporous silica particles for ibuprofen
delivery¡±, Korean Journal of Chemical Engineering, 27 (4), pp.1333-1337
(2010, Jul. 1).
8. Sang Ho Woo, Yil Wook Kim, Pyung Yong Um,
Hae-Min Lee, and Chang-Koo Kim, ¡°Film Properties of Nitrogen-Doped
Polycrystalline Silicon for Advanced Gate Material¡±, Korean Journal of
Chemical Engineering, 26 (3), pp.824-827 (2009, May 1).
9.
Chijung Kim, Donghun Jeong, Jinha Hwang, Heeyeop Chae, and Chang-Koo
Kim, ¡°Argon and nitrogen plasma surface treatments of polyimide films
for electroless copper plating¡±, Journal of the Korean Physical
Society, 54 (2), pp.621-627 (2009, Feb. 2).
10. Sungi Jang,
Heeyeop Chae, Donggeun Jung, Hyoungsub Kim, and Chang-Koo Kim,
¡°Simultaneous Oxygen Plasma and Thermal Treatments of an ITO Surface to
Improve the Electrical Characteristics of Organic Light-Emitting
Diodes¡±, Journal of the Korean Physical Society, 51 (3), pp.956-962
(2007, Sep. 9).
11. Hyeong Jin Yun, Tae Ho Kim, Chee Burm Shin,
Chang-Koo Kim, Jae-Ho Min, and Sang-Heup Moon, ¡°Comparison of atomic
scale etching of poly-Si in inductively coupled Ar and He plasmas¡±,
Korean Journal of Chemical Engineering, 24 (4), pp.670-673 (2007, Jul.
1).
12. Chang-Koo Kim, ¡°Ion Dynamics in Plasma Processing for
the Fabrication of Ultrafine Structures¡±, Korean J. Chem. Eng., 22 (5),
pp.762-769 (2005).
13. Chang-Koo Kim, ¡°Analysis of Langmuir Probe Data in High Density Plasmas¡±, Korean J. Chem. Eng., 21 (3), pp.746-751 (2004).
14.
Jung-Hyun Ryu, Byeong-Ok Cho, Sung-Wook Hwang, Sang Heup Moon, and
Chang-Koo Kim, ¡°Trajectories of Ions inside Faraday Cage Located in a
High Density Plasma Etcher¡±, Korean J. Chem. Eng., 20 (2), pp.407-413
(2003).
15. Chang-Koo Kim, Chan-Hwa Chung, and Sang Heup Moon,
¡°Removal of Organic Impurities from the Silicon Surface by Oxygen and
UV Cleaning¡±, Korean J. Chem. Eng.,13 (3), pp.328-330 (1996).
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| Domestic Journal (non-SCI)
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1.
Hyeok-Kyu Kwon, Sanghyun You, Jun-Hyun Kim, and Chang-Koo Kim, ¡°Optical
and Electrical Characteristics of Fluorocarbon Films Deposited in aa
High-Density C4F8 Plasma¡±, Korean Chemical Engineering Research, 59,
pp.254-259 (2021, February 6). 2.
Jun-Hyun Kim, Chang Jin Park, and Chang-Koo Kim, ¡°Atmospheric floating
electrode-dielectric barrier discharges (FE-DBDs) having flexible
electrodes¡±, Korean Chemical Engineering Research, 57, pp.432-437
(2019, March 23). 3.
Hae-Min Lee, Sung-Woon Cho, Jun-Hyun Kim, and Chang-Koo Kim,
¡°Electrochemical analysis of the electrodeposition of platinum
nanoparticles¡±, Korean Chemical Engineering Research, 53 (5),
pp.540-544 (2015). 4.
Jung Min Ji, Sung-Woon Cho, and Chang-Koo Kim, ¡°Effects of Ar addition
on the etch rates and etch profiles of Si substrates during the Bosch
process¡±, Korean Chemical Engineering Research, 51 (6), pp.755-759
(2013). 5.
Tae Ho Kim, Hyeong Jin Yun, and Chang-Koo Kim, ¡°Electroless Plating of
Co-Alloy Thin Films using Alkali-Free Chemicals¡±, Korean Chemical
Engineering Research, 45 (6), pp.633-637 (2007). 6.
Chang-Koo Kim, ¡° A Study on the Energy and Angular Distribution of Ions
Effusing from a Hole in Contact with a High Density Plasma¡±, Transport
Phenomena, 17 (1), pp.23-28 (2003). 7. Chang-Koo Kim, ¡°Introduction to Atomic Layer Etching¡±, Materials, 13 (2), pp.2-7 (2002).
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| Proceeding Volume
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1. Yil Wook Kim, Sang Ho Woo, Hai
Won Kim, Pyung Yong Um, Jung-Min Ji, and Chang-Koo Kim, ¡°Formation and
characterization of thin silicon dioxide films obtained by inductively-coupled
high-density plasmas using a dual rotated spiral antenna system¡±, ECS
Transactions, 25 (6), pp.173-178 (2009).
2. Sang Ho Woo, Yil Wook Kim,
Pyung Yong Um, Hai Won Kim, Sung Kil Cho, Hyung Su Choe, Dong Keu Lee, and
Chang-Koo Kim, ¡°Structural And
Morphological Properties of Nitrogen-Doped Polysilicon for Advanced Gate
Material¡±, ECS Transactions, 11 (4), pp.601-606 (2007).
3. Chang-Koo
Kim and Demetre J. Economou, ¡°Energy and Angular Distribution of Ions Extracted
from a Large Hole in contact with a High Density Plasma¡±, in Fundamental Gas-Phase and Surface Chemistry
of Vapor-Phase Deposition ¥±, Electrochem. Soc. Symp.
Proc. PV2001-13, edited by M. T. Swilhart, M. D. Allendorf, and M.
Meyyappan, pp.405-414 (2001).
4. Chan-Hwa
Chung, Chang-Koo Kim, and Sang Heup Moon, ¡°Monitoring of the Surface Species on
Silicon After Chemical Cleaning Cy FTIR Spectroscopy¡±, in Ultraclean Semiconductor Processing Technology and Surface Chemical
Cleaning and Passivation, Mat. Res. Soc. Symp. Proc. Vol. 386, edited by Michael Liehr, Marc Heyns, Masataka Hirose, and
Harold Parks, pp.291-296 (1995).
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