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1.
Sanghyun You, Inkyoung Cho, Yu Gwang Jeong, Chang-Koo Kim,
"Environmentally Sustainable C3F6 as High-Performance Alternative to
CF4 for Plasma Etching of SiO2", ECS Journal of Solid State Science and
Technology, 14, 111005 (2025, November 12).
2. Sanghyun You,
Minuk Kim, Inkyoung Cho, Junyoung Kim, Sangheon Lee, Chang-Koo Kim,
"Cyclic etching of SiO2 contact holes using heptafluoropropyl methyl
ether having low global-warming potential", MATERIALS & DESIGN,
114797 (2025, September 24).
3. Seokjin Ko, Dongryul Lee,
Jeongmin Kim, Chang-Koo Kim, Jihyun Kim,"Self-Aligned Edge Contact
Process for Fabricating High-Performance Transition-Metal Dichalcogenide
Field-Effect Transistors", ACS Nano, pp.25009- pp.25017 (2024, August
22).
4. Sang-Hyun You, Eun Jae Sun, Heeyeop Chae, Chang-Koo Kim,
"Effect of Discharge Gas Composition on SiC Etching in
an HFE-347mmy/O2/Ar Plasma", Materials, 17, pp.3917 (2024,
August 7).
5.
Sanghyun You, Eun Jae Sun, Yujeong Hwang, and Chang-Koo Kim,
¡°Heptafluoroisopropyl Methyl Ether as a Low Global Warming Potential
Alternative for Plasma Etching of SiC¡±, Korean Journal of Chemical
Engineering, 41, pp. 1307-1310 (2024 February 5).
6. Sanghyun
You, Hyun Seok Yang, Dongjun Jeon, Heeyeop Chae, and Chang-Koo Kim,
¡°Controlling Bowing and Narrowing in SiO2 Contact-Hole Etch Profiles
Using Heptafluoropropyl Methyl Ether as an Etchant with Low Global
Warming Potential¡±, Coatings, 13(8), pp. 1452-1458 (2023, August 16).
7.
Sungun Kang, Chul-Ho Kim, Sanghyun You, Da-Young Lee, Yu-Kwon Kim,
Seung-Joo Kim, Chang-Koo Kim and Hee-Kyung Kim, ¡°Plasma Surface
Modification of 3Y-TZP at Low and Atmospheric Pressures with Different
Treatment Times¡±, International Journal of Molecular Sciences, 24,
pp.7663-7679 (2023, February 14).
8. Yongjae Kim, Seoeun Kim,
Hojing Kang, Sanghyun You, Chang-Koo Kim, and Heeyeop Chae, ¡°Low Global
Warming C4H3F7O Isomers for Plasma Etching of SiO2 and Si3N4 Films¡±,
ACS SUSTAINABLE CHEMISTRY & ENGINEERING, 10, pp.10537-10546 (2022,
August 1).
9. Yongwoo Jang, Junsoo Bok, Dong Keun Ahn, Chang-Koo
Kim, and Ju-Seop Kang, ¡°Human Trial for the Effect of Plasma-Activated
Water Spray on Vaginal Cleaning in Patients with Bacterial Vaginosis¡±,
Medical Science, 10, pp.331-339 (2022, June 18).
10. Sanghyun
You, Yu Jong Lee, Heeyeop Chae, and Chang-Koo Kim, ¡°Plasma Etching of
SiO2 Contact Holes Using Hexafluoroisopropanol and C4F8¡±, Coatings, 12,
pp.6791-6798 (2022, May 16).
11. Jun-Hyun Kim, Sanghyun You,
Chang-Koo Kim, ¡°Plasma etching of SiO2 contact hole using
perfluoropropyl vinyl ether and perfluoroisopropyl vinyl ether¡±, Korean
Journal of Chemical Engineering, 39, pp.63-68 (2022, January 6).
12.
Jun-Hyun Kim, Sanghyun You, Chang-Koo Kim, ¡°Surface Texturing of Si
with Periodically Arrayed Oblique Nanopillars to Achieve
Antireflection¡±, Materials, 14, pp.3801-3809 (2021, January 14).
13.
Jun-Hyun Kim, Jin-Su Park, Chang-Koo Kim, ¡°SiO2 etching in inductively
coupled plasmas using heptafluoroisopropyl methyl ether and
1,1,2,2-tetrafluoroethyl 2,2,2-trifluoroethyl ether¡±, Applied Surface
Science, 508, pp.144787-1-144787-8 (2020, April 1).
14.
Jeong-Guen Bak, Jun-Hyun Kim, Chang-Koo Kim, ¡°Electrical resistivity of
Ni–Fe wires coated with Sn using low-pressure chemical vapor
deposition¡±, Coatings, 10, pp.317-1 -317-9 (2020, March 27).
15.
Jun-Hyun Kim, Chang-Koo Kim, ¡°Si3N4 etch rates at various ion-incidence
angles in high-density CF4, CHF3, and C2F6 plasmas¡±, Korean Journal of
Chemical Engineering, 37, pp.374-379, (2020, January 30).
16.
Jun-Hyun Kim, Jin-Su Park, Yong-Seon Shin, Chang-Koo Kim,
¡°Atmospheric-pressure floating electrode-dielectric barrier discharge
with flexible electrodes: Effect of conductor shapes¡±, Korean Journal
of Chemical Engineering, 36, pp.1371-1376 (2019, July 31).
17.
Jin-Su Park, Suhyun Kim, Jun-Hyun Kim, Chang-Koo Kim, and Jihyun Kim,
"Auto-masked texturing of kerf-loss free silicon wafers using
hexafluoroisopropanol in a capacitively coupled plasma etching system",
ECS Journal of Solid State Science and Technology, 8, pp.Q76-Q79 (2019,
May 13).
18. Jun-Hyun Kim, Jin-Su Park, Chang-Koo Kim, ¡°Angular
dependence of SiO2 etching in plasmas containing heptafluoropropyl
methyl ether¡±, Thin Solid Films, 669, pp.262-268 (2019, January 1).
19.
Jun-Hyun Kim, Jin-Su Park, Chang-Koo Kim, ¡°Plasma etching of SiO2 using
heptafluoropropyl methyl ether and perfluoropropyl vinyl ether¡±, ECS
Journal of Solid State Science and Technology, 7, pp.Q218-Q221 (2018,
November 17).
20. Hyemin Lee, Jun-Hyun Kim, Gaoxiang Wu, Hae-Min
Lee, Jaekyoung Kim, Dokyeong Kwon, Shu Yang, Chang-Koo Kim, and Hyunsik
Yoon, ¡°Clustering and self-recovery of slanted hydrogel micropillars¡±,
Advanced Materials Interfaces, 5, pp.1801142 (2018, October 17).
21.
Suhyun Kim, Jun-Hyun Kim, Jihyun Kim, and Chang-Koo Kim, ¡°Reducing the
optical reflectance of kerf-loss free silicon wafers via auto-masked
CF4/O2 plasma etch¡±, ECS Journal of Solid State Science and Technology,
7, pp.Q88-Q91 (2018, May 16).
22. Sooyeoun Oh, Chang-Koo Kim,
Jihyun Kim, ¡°High responsivity ¥â-Ga2O3 metal-semiconductor-metal
solar-blind photodetectors with ultra-violet transparent graphene
electrodes¡±, ACS Photonics, 5, pp.1123-1128 (2018, March 21).
23.
Jun-Hyun Kim, Jeong Geun Bak, Kangtaek Lee, Chang-Koo Kim, ¡°Control of
the electrical resistivity of Ni-Cr wires using low pressure chemical
vapor deposition of tin¡±, Applied Surface Science, 429, pp.134-137
(2018, January 31).
24. Kyongbeom Koh, Yongjae Kim, Chang-Koo
Kim, and Heeyeop Chae, ¡°Quasi Atomic Layer Etching of SiO2 using
Surface Fluorination for Surface Cleaning¡±, Journal of Vacuum Science
and Technology A, 36, pp.01B106-1-5 (2018, January 1).
25.
Jun-Hyun Kim, Sung-Woon Cho, and Chang-Koo Kim, ¡°Angular dependence of
Si3N4 etching in C4F6/CH2F2/O2/Ar plasmas¡±, Chemical Engineering &
Technology, 40, pp.2251-2256 (2017, December 1).
26. Jun-Hyun
Kim, Sung-Woon Cho, Chang Jin Park, Heeyeop Chae, Chang-Koo Kim,
¡°Angular dependences of SiO2 etch rates at different bias voltages in
CF4, C2F6, and C4F8 plasmas¡±, Thin Solid Films, 637, pp.43-48 (2017,
September 1).
27. Hae-Min Lee, Gyoung Hwa Jeong, Sang-Wook Kim,
Chang-Koo Kim, ¡°Low-temperature direct synthesis of mesoporous vanadium
nitrides for electrochemical capacitors¡±, Applied Surface Science, 400,
pp.194-199 (2017, April 1).
28. Haegyu Jang, Hakseung Lee,
Honyoung Lee, Chang-Koo Kim, Heeyeop Chae, ¡°Sensitivity enhancement of
dielectric plasma etching endpoint detection by optical emission
spectra with modified K-means cluster analysis¡±, IEEE Transactions on
Semiconductor Manufacturing, 30, pp.17-22 (2017, February 1).
29.
Sung-Woon Cho, Jun-Hyun Kim, Hae-Min Lee, Heeyeop Chae, Chang-Koo Kim,
¡°Superhydrophobic Si surfaces having microscale rod structures prepared
in a plasma etching system¡±, Surface & Coatings Technology, 306,
pp.82-86 (2016, November 25).
30. Sung-Woon Cho, Hae-Min Lee,
Jun-Hyun Kim, Jeong Geun Bak, Chang-Koo Kim, ¡°Fabrication of Slanted Cu
Nanopillars with Uniform Arrays¡±, Nanomaterials and Nanotechnology, 6,
pp.1-5 (2016, March 1).
31. Jun-Hyun Kim, Sung-Woon Cho, Doo Won
Kang, Kyung Mi Lee, Chang Yong Baek, Hae-Min Lee, and Chang-Koo Kim,
¡°Electrical, structural, and morphological characteristics of
dopantless tin oxide films prepared by low pressure chemical vapor
deposition¡±, Science of Advanced Materials, 8, pp.117-121 (2016,
January 1).
32. Taegyeong Kang, Kiju Um, Jinmo Park, Hochan
Chang, Doh C. Lee, Chang-Koo Kim, Kangtaek Lee ¡°Minimizing the
fluorescence quenching caused by uncontrolled aggregation of CdSe/CdS
core/shell quantum dots for biosensor applications¡±, Sensors and
Actuators B: Chemical, 222, pp.871-878 (2016, January 1).
33.
Thanh-Truc Pham, Chinh Nguyen-Huy, Hyun-Jun Lee, Thuy-Duong
Nguyen-Phan, Tae Hwan Son, Chang-Koo Kim, and Eun Woo Shin, ¡°Cu-doped
TiO2/reduced graphene oxide thin-film photocatalysts: Effect of Cu
content upon methylene blue removal in water¡±, Ceramics International,
41 (9), pp.11184-11193 (2015, November 1).
34. Sung-Woon Cho,
Jun-Hyun Kim, Jeong Geun Bak, and Chang-Koo Kim, ¡°Fabrication of
uniformly arrayed single- and multi-directional slanted Cu nanorods¡±,
ECS Solid State Letters, 4 (11), pp.P85-P87 (2015, November 1).
35.
Sung-Woon Cho, Jun-Hyun Kim, Sangin Kim, Eun Woo Shin, and Chang-Koo
Kim, ¡°Reduction in the diameter of contact holes with a high anisotropy
and aspect ratio¡±, ECS Journal of Solid State Science and Technology, 4
(7), pp.P226-P231 (2015, July 1).
36. Thuy-Duong Nguyen-Phan,
Chinh Nguyen Huy, Chang-Koo Kim, and Eun Woo Shin, ¡°Facile
microwave-assisted synthesis and controllable architecture of
three-dimensional nickel titanate¡±, CrystEngComm, 17 (24), pp.4562-4574
(2015, June 28).
37. Hae-Min Lee, Gyoung Hwa Jeong, Doo Won
Kang, Sang-Wook Kim, Chang-Koo Kim, ¡°Direct and environmentally benign
synthesis of manganese oxide/graphene composites from graphite for
electrochemical capacitors¡±, Journal of Power Sources, 281, pp.44-48
(2015, May 1).
38. Hae-Min Lee, Sung-Woon Cho, Chan-Ju Song,
Heung Jung Kang, Bum Jin Kwon, Chang-Koo Kim, ¡°Abrupt change with
surfactant concentration in the surface morphology of the
electrodeposited manganese oxide films for electrochemical capacitors¡±,
Electrochimica Acta, 160, pp.50-56 (2015, April 1).
39. Chang
Yeong Jeong, Chang-Koo Kim and Sangin Kim, ¡°Slot-embedded
photonic-crystal resonator with enhanced modal confinement¡±, Optics
Letters, 40, pp.554-557 (2015, Feb. 15).
40. Sung-Woon Cho,
Jun-Hyun Kim, Doo Won Kang, Kangtaek Lee, and Chang-Koo Kim, ¡°Single-
and multi-directional slanted plasma etching of silicon under practical
plasma processing conditions¡±, ECS Journal of Solid State Science and
Technology, 3 (11), pp.Q215-Q220 (2014, November 1).
41. Gyoung
Hwa Jeong, Hae-Min Lee, Ji-goo Kang, Heewoong Lee, Chang-Koo Kim,
Jae-Hyeok Lee, Jae-Ho Kim, and Sang-Wook Kim, ¡°ZrO2-SiO2 nanosheets
with ultrasmall WO3 nanoparticles and their enhanced pseudocapacitance
and stability¡±, ACS Applied Materials & Interfaces, 6,
pp.20171-20178 (2014, October 27).
42. Gyoung Hwa Jeong, Hae-Min
Lee, Heewoong Lee, Chang-Koo Kim, Yuanzhe Piao, Jae-Hyeok Lee, Jae-Ho
Kim and Sang-Wook Kim, ¡°One-pot synthesis of thin Co(OH)2 nanosheets on
graphene and their high activity as a capacitor electrode¡±, RSC
Advances, 4, pp.51619-51623 (2014, October 7).
43. Hae-Min Lee,
Kangtaek Lee, and Chang-Koo Kim, ¡°Electrodeposition of manganese-nickel
oxide films on a graphite sheet for electrochemical capacitor
applications¡±, Materials, 7, pp.265-274 (2014, January 9).
44.
Haegyu Jang, Jaewook Nam, Chang-Koo Kim, and Heeyeop Chae, ¡°Real-time
endpoint detection of small exposed area SiO2 films in plasma etching
using plasma impedance monitoring with modified principal component
analysis¡±, Plasma Processes and Polymers, 10 (10), pp.850-856 (2013,
October 1).
45. S. Rajagopal, D. Nataraj, O. Y. Khyzhun, Yahia
Djaoued, Jacques Robichaud, and Chang-Koo Kim, ¡°Controlled synthesis of
MoO3 microcrystals by subsequent calcination of hydrothermally grown
pyrazine-MoO3 nanorod hybrids and their photodecomposition properties¡±,
Materials Chemistry and Physics, 141, pp.383-392 (2013, August 15).
46.
Cheolsang Yoon, Hyun-Guk Hong, Hyun Chang Kim, Daehyun Hwang, Doh C.
Lee, Chang-Koo Kim, Young-Joo Kim, Kangtaek Lee, ¡°High luminescence
efficiency white light emitting diodes based on surface functionalized
quantum dots dispersed in polymer matrices¡±, Colloids and Surfaces A:
Physicochemical and Engineering Aspects, 428, pp.86-91 (2013, Apr. 02).
47.
Sung-Woon Cho, Chang-Koo Kim, Jin-Kwan Lee, Sang Heup Moon, and Heeyeop
Chae, ¡°Angular dependences of SiO2 etch rates in C4F6/O2/Ar and
C4F6/CH2F2/O2/Ar plasmas¡±, Journal of Vacuum Science and Technology A,
30 (5), pp.051301-1 - 051301-6 (2012, July 3).
48. S. G.
Kandalkar, Hae-Min Lee, Seung Hye Seo, Kangtaek Lee, and Chang-Koo Kim,
¡°Cobalt-nickel composite films synthesized by chemical bath deposition
method as an electrode material for supercapacitors¡±, Journal of
Materials Science, 46 (9), pp.2977-2981 (2011, May 1).
49. S. G.
Kandalkar, Hae-Min Lee, Heeyeop Chae, and Chang-Koo Kim, ¡°Structural,
morphological, and electrical characteristics of the electrodeposited
cobalt oxide electrode for supercapacitor applications¡±, Materials
Research Bulletin, 46 (1), pp.48-51 (2011, Jan. 1).
50. S. G.
Kandalkar, D. S. Dhawale, Chang-Koo Kim, and C. D. Lokhande, ¡°Chemical
synthesis of cobalt oxide thin film electrode for supercapacitor
application¡±, Synthetic Metals, 160 (11-12), pp.1299-1302 (2010, June
1). 2.109
51. Minho Noh, Taehoon Kim, Hosub Lee, Chang-Koo Kim,
Sang-Woo Joo, and Kangtaek Lee, ¡°Fluorescence Quenching Caused by
Aggregation of Water-Soluble CdSe Quantum Dots¡±, Colloids and Surfaces
A: Physicochemical and Engineering Aspects, 359 (1-3), pp.39-44 (2010,
Apr. 20).
52. Jin-Kwan Lee, Il-Yong Jang, Seung-Haeng Lee,
Chang-Koo Kim, and Sang Heup Moon, ¡°Mechanism of sidewall necking and
bowing in the plasma etching of high aspect-ratio contact holes¡±,
Journal of the Electrochemical Society, 157 (3), pp.D142-D146 (2010,
Jan. 12). 2.588
53. Jin-Kwan Lee, Il-Yong Jang, Seung-Haeng Lee,
Chang-Koo Kim, and Sang Heup Moon, ¡°Cyclic deposition/etching process
to etch a bowing-free SiO2 contact hole¡±, Journal of the
Electrochemical Society, 156 (8), pp.D269-D274 (2009, Aug. 1). 2.588
54.
Jin-Kwan Lee, Seung-Haeng Lee, Jae-Ho Min, Il-Yong Jang, Chang-Koo Kim,
and Sang Heup Moon, ¡°Oblique-directional plasma etching of Si using a
Faraday cage¡±, Journal of the Electrochemical Society, 156 (7),
pp.D222-D225 (2009, Jul. 1). 2.588
55. Hae-Min Lee, Santosh K.
Mahapatra, John Kiran Anthony, Fabian Rotermund, and Chang-Koo Kim,
¡°Effect of titanium ion concentration on electrodeposition of
nanostructured TiNi films¡±, Journal of Materials Science, 44 (14),
pp.3731-3735 (2009, Jul. 15).
56. S. M. S. I. Dulal, Hyeong Jin
Yun, Chee Burm Shin, and Chang-Koo Kim, ¡°Electrodeposition of CoWP film
V. Structural and morphological characterisations¡±, Applied Surface
Science, 255 (11), pp.5795-5801 (2009, Mar. 15). 2.112
57.
Hyongmoo Rhee, Hae Min Lee, Yun Mi Namkoung, Chang-Koo Kim, Heeyeop
Chae, and Yil Wook Kim, ¡°Dependence of etch rates of silicon substrates
on the use of C4F8 and C4F6 plasmas in the deposition step of the Bosch
process¡±, Journal of Vacuum Science and Technology B, 27 (1), pp.33-40
(2009, Jan. 12).
58. S. M. S. I. Dulal, Tae Ho Kim, Hyongmoo
Rhee, Joon Yong Sung, and Chang-Koo Kim, ¡°Development of an
alkali-metal-free bath for electroless deposition of Co-W-P capping
layers for copper interconnections¡±, Journal of Alloys and Compounds,
467 (1-2), pp.370-375 (2009, Jan. 7).
59. Hyeong Jin Yun, S. M.
S. I. Dulal, Chee Burm Shin, and Chang-Koo Kim, ¡°Characterisation of
electrodeposited Co-W-P amorphous coatings on carbon steel¡±,
Electrochimica Acta, 54 (2), pp.370-375 (2008, Dec. 30). 3.777
60.
S. M. S. I. Dulal, Tae Ho Kim, Chee Burm Shin, and Chang-Koo Kim,
¡°Electrodeposition of CoWP film IV. Effect of applied potential and
current density¡±, Journal of Alloys and Compounds, 461 (1-2),
pp.382-388 (2008, Aug. 11). 2.390
61. John Kiran Anthony, Hee
Cheoul Kim, Hwang Woon Lee, S. Kumar Mahapatra, Hae Min Lee, Chang-Koo
Kim, Kihong Kim, Hanjo Lim, and Fabian Roterrmund, ¡°Particle
size-dependent giant nonlinear absorption in nanostructured Ni-Ti
alloys¡±, Optics Express, 16 (15), pp.11193-11202 (2008, Jul. 10). 3.546
62.
Tae Ho Kim, S. M. S. I. Dulal, Chang Han Park, Heeyeop Chae, and
Chang-Koo Kim, ¡°Optimisation of process parameters for electroless
plating of Co–W–P capping layers from an alkali-metal-free bath¡±,
Surface & Coatings Technology, 202 (19), pp.4861-4867 (2008, Jun.
25). 1.941
63. Hyongmoo Rhee, Hyeokkyu Kwon, Chang-Koo Kim,
HyunJung Kim, Jaisuk Yoo, and Yil Wook Kim, ¡°Comparison of deep silicon
etching using SF6/C4F8 and SF6/C4F6 plasmas in the Bosch process¡±,
Journal of Vacuum Science and Technology B, 26 (2), pp.576-581 (2008,
Mar. 28). 1.267
64. S. M. S. I. Dulal, Chee Burm Shin, Joon Yong
Sung, and Chang-Koo Kim, ¡°Electrodeposition of CoWP film II. Effect of
electrolyte concentration¡±, Journal of Applied Electrochemistry, 38
(1), pp.83-91 (2008, Jan. 1). 1.836
65. S. M. S. I. Dulal,
Hyeong Jin Yun, Chee Burm Shin, and Chang-Koo Kim, ¡°Electrodeposition
of CoWP film III. Effect of pH and temperature¡±, Electrochimica Acta,
53 (2), pp.934-943 (2007, Dec. 1). 3.777
66. S. M. S. I. Dulal,
Hyeong Jin Yun, Chee Burm Shin, and Chang-Koo Kim, ¡°Electrodeposition
of CoWP Film I. Electrochemical and Compositional Analyses¡±, Journal of
Electrochemical Society, 154 (10), pp.D494-D501 (2007, Oct. 1). 2.588
67.
Hyun-Kyu Ryu, Yil-Wook Kim, Kangtaek Lee, Chee Burm Shin, and Chang-Koo
Kim, ¡°A Comparative Study on a High Aspect Ratio Contact Hole Etching
in UFC-containing and PFC-containing Plasmas¡±, Microelectronics
Journal, 38 (1), pp.125-129 (2007, Jan. 1).
68. Jae-Ho Min,
Jin-kwan Lee, Sang Heup Moon, and Chang-Koo Kim, ¡°Interactive
Relationships between Sidewall and Bottom Etch Rates, As-affected by
Sidewall angle, during SiO2 Etching in a CHF3 Plasma¡±, Journal of
Vacuum Science and Technology B, 24 (4), pp.1746-1754 (2006, Jul. 1).
69.
Hyun-Kyu Ryu, Yil-Wook Kim, Chee Burm Shin, and Chang-Koo Kim, ¡°Effect
of Wafer Cleaning on the Interconnect Structure and Its Electrical
Properties during the Al Dual Damascene Process for the Fabrication of
Sub-100 nm Memory Devices¡±, Journal of Chemical Engineering of Japan,
38 (11), pp.922-928 (2005).
70. Jae-Ho Min, Jin-kwan Lee, Sang
Heup Moon, and Chang-Koo Kim, ¡°Deep Etching of Silicon with Smooth
Sidewalls by an Improved Gas-Chopping Process Using a Faraday Cage and
a High Bias Voltage¡±, J. Vac. Sci. Tech. B, 23 (4), pp.1405-1411 (2005).
71.
Jae-Ho Min, Gyeo-Re Lee, Jin-kwan Lee, Sang Heup Moon, and Chang-Koo
Kim, ¡°Effect of Sidewall Properties on the Bottom Microtrench during
SiO2 Etching in a CF4 Plasma¡±, J. Vac. Sci. Tech. B, 23 (2), pp.425-432
(2005).
72. Chang-Koo Kim and Chee Burm Shin, ¡°Plasma Molding
over Surface Topography: Measurement of Energy and Angular
Distributions of Ions Extracted through a Large Hole¡±, Thin Solid
Films, 475 (1-2), pp.24-31 (2005). 1.604
73. Jae-Ho Min, Gyeo-Re
Lee, Jin-kwan Lee, Chang-Koo Kim, and Sang Heup Moon ¡°Improvement
of SiO2 Pattern Profiles Etched in CF4 and SF6 Plasmas by Using a
Faraday Cage and Neutral Beams¡±, Surface and Coatings Technology, 193
(1-3), pp.75-80 (2005).
74. Zhijian Wu, Hyeonwoo Joo, Ik-Sung
Ahn, Jung-Hyun Kim, Chang-Koo Kim, and Kangtaek Lee, ¡°Design of Doped
Hybrid Xerogels for a Controlled Release of Brillant Blue FCF¡±, Journal
of Non-Crystalline Solids, 342, pp.46-53 (2004). 1.597
75.
Jae-Ho Min, Gyeo-Re Lee, Jin-kwan Lee, Sang Heup Moon, and Chang-Koo
Kim, ¡°Angular Dependence of Etch Rates in the Etching of Poly-Si and
Fluorocarbon Polymer Using SF6, C4F8, and O2 Plasmas¡±, J. Vac. Sci.
Tech. A, 22 (3), pp.661-669 (2004).
76. Jae-Ho Min, Gyeo-Re Lee,
Jin-kwan Lee, Sang Heup Moon, and Chang-Koo Kim, ¡°Dependences of Bottom
and Sidewall Etch Rates on Bias Voltage and Source Power during the
Etching of Poly-Si and Fluorocarbon Polymer Using SF6, C4F8, and O2
Plasmas¡±, J. Vac. Sci. Tech. B, 22 (3), pp.893-901 (2004).
77.
Hyun-Kyu Ryu, Byung-Seok Lee, Sung-Ki Park, Il-Wook Kim, and Chang-Koo
Kim, ¡°Effect of CH2F2 Addition on a High Aspect Ratio Contact Hole
Etching in a C4F6/O2/Ar Plasma¡±, Electrochemical and Solid-State
Letters, 6 (9), pp.C126-C129 (2003). 2.010
78. Chang-Koo Kim and
Demetre J. Economou, ¡°Plasma Molding over Surface Topography: Energy
and Angular Distribution of Ions Extracted out of Large Holes¡±, J.
Appl. Phys., 91 (5), pp.2594-2603 (2002). 2.210
79. Chang-Koo
Kim, A. Kubota and Demetre J. Economou, ¡°Molecular Dynamics Simulation
of Silicon Surface Smoothing by Low-Energy Argon Cluster Impact¡±, J.
Appl. Phys. 86 (12), pp.6758-6762 (1999).
80. Chang-Koo Kim,
Chang-Hwa Chung, and Sang Heup Moon, ¡°Suppression of Oxide Growth on
Porous Silicon by treatment with HF Vapor¡±, J. Appl. Phys. 78 (12),
pp.7392-7394 (1995).
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| Domestic Journal (SCI)
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1.
Jun-Hyun Kim, Jin-Su Park, Yong-Seon Shin, and Chang-Koo Kim,
""Atmospheric-pressure floating electrode-dielectric barrier discharge
with flexible electrodes: Effect of conductor shapes", Korean Journal
of Chemical Engineering, 36, pp.1371-1376 (2019, July 31).
2.
Jun-Hyun Kim, Hae-Min Lee, Doo Won Kang, Kyung Mi Lee, and Chang-Koo
Kim, ¡°Effect of oxygen flow rate on the electrical and optical
characteristics of dopantless tin oxide films fabricated by LPCVD¡±,
Korean Journal of Chemical Engineering, 33 (9), pp.2711-2715 (2016,
Sep. 1).
3. S. Rajagopal, Hae-Min Lee, Kangtaek Lee, and
Chang-Koo Kim, ¡°Hydrothermal synthesis of one-dimensional tungsten
oxide nanostructures using cobalt ammonium sulfate as a
structure-directing agent¡±, Korean Journal of Chemical Engineering, 30
(10), pp.1833-1835 (2013, Oct. 1).
4. Hae-Min Lee, Heeyeop Chae,
and Chang-Koo Kim, ¡°Electroless deposition of NiMoP films using
alkali-free chemicals for capping layers of copper interconnections¡±
Korean Journal of Chemical Engineering, 29 (9), pp.1259-1265 (2012,
Sep. 1).
5. Sunil G. Kandalkar, Hae-Min Lee, Seung Hye Seo,
Kangtaek Lee, and Chang-Koo Kim, ¡°Preparation and characterization of
the electrodeposited Ni-Co oxide thin films for electrochemical
capacitors¡±, Korean Journal of Chemical Engineering, 28 (6),
pp.1464-1467 (2011, Jun. 1).
6. Yun Mi Namkoung, Hae-Min Lee,
Young-Seon Son, Kangtaek Lee, and Chang-Koo Kim, ¡°Characteristics of
electrodeposited CoWP capping layers using alkali-metal-free
precursors¡±, Korean Journal of Chemical Engineering, 27 (5),
pp.1596-1600 (2010, Sep. 1).
7. Kitae Lee, Deokkyu Lee, Hosub
Lee, Chang-Koo Kim, Zhijian Wu, and Kangtaek Lee, ¡°Comparison of
amine-functionalized mesoporous silica particles for ibuprofen
delivery¡±, Korean Journal of Chemical Engineering, 27 (4), pp.1333-1337
(2010, Jul. 1).
8. Sang Ho Woo, Yil Wook Kim, Pyung Yong Um,
Hae-Min Lee, and Chang-Koo Kim, ¡°Film Properties of Nitrogen-Doped
Polycrystalline Silicon for Advanced Gate Material¡±, Korean Journal of
Chemical Engineering, 26 (3), pp.824-827 (2009, May 1).
9.
Chijung Kim, Donghun Jeong, Jinha Hwang, Heeyeop Chae, and Chang-Koo
Kim, ¡°Argon and nitrogen plasma surface treatments of polyimide films
for electroless copper plating¡±, Journal of the Korean Physical
Society, 54 (2), pp.621-627 (2009, Feb. 2).
10. Sungi Jang,
Heeyeop Chae, Donggeun Jung, Hyoungsub Kim, and Chang-Koo Kim,
¡°Simultaneous Oxygen Plasma and Thermal Treatments of an ITO Surface to
Improve the Electrical Characteristics of Organic Light-Emitting
Diodes¡±, Journal of the Korean Physical Society, 51 (3), pp.956-962
(2007, Sep. 9).
11. Hyeong Jin Yun, Tae Ho Kim, Chee Burm Shin,
Chang-Koo Kim, Jae-Ho Min, and Sang-Heup Moon, ¡°Comparison of atomic
scale etching of poly-Si in inductively coupled Ar and He plasmas¡±,
Korean Journal of Chemical Engineering, 24 (4), pp.670-673 (2007, Jul.
1).
12. Chang-Koo Kim, ¡°Ion Dynamics in Plasma Processing for
the Fabrication of Ultrafine Structures¡±, Korean J. Chem. Eng., 22 (5),
pp.762-769 (2005).
13. Chang-Koo Kim, ¡°Analysis of Langmuir Probe Data in High Density Plasmas¡±, Korean J. Chem. Eng., 21 (3), pp.746-751 (2004).
14.
Jung-Hyun Ryu, Byeong-Ok Cho, Sung-Wook Hwang, Sang Heup Moon, and
Chang-Koo Kim, ¡°Trajectories of Ions inside Faraday Cage Located in a
High Density Plasma Etcher¡±, Korean J. Chem. Eng., 20 (2), pp.407-413
(2003).
15. Chang-Koo Kim, Chan-Hwa Chung, and Sang Heup Moon,
¡°Removal of Organic Impurities from the Silicon Surface by Oxygen and
UV Cleaning¡±, Korean J. Chem. Eng.,13 (3), pp.328-330 (1996).
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| Domestic Journal (non-SCI)
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1.
Hyeok-Kyu Kwon, Sanghyun You, Jun-Hyun Kim, and Chang-Koo Kim, ¡°Optical
and Electrical Characteristics of Fluorocarbon Films Deposited in aa
High-Density C4F8 Plasma¡±, Korean Chemical Engineering Research, 59,
pp.254-259 (2021, February 6). 2.
Jun-Hyun Kim, Chang Jin Park, and Chang-Koo Kim, ¡°Atmospheric floating
electrode-dielectric barrier discharges (FE-DBDs) having flexible
electrodes¡±, Korean Chemical Engineering Research, 57, pp.432-437
(2019, March 23). 3.
Hae-Min Lee, Sung-Woon Cho, Jun-Hyun Kim, and Chang-Koo Kim,
¡°Electrochemical analysis of the electrodeposition of platinum
nanoparticles¡±, Korean Chemical Engineering Research, 53 (5),
pp.540-544 (2015). 4.
Jung Min Ji, Sung-Woon Cho, and Chang-Koo Kim, ¡°Effects of Ar addition
on the etch rates and etch profiles of Si substrates during the Bosch
process¡±, Korean Chemical Engineering Research, 51 (6), pp.755-759
(2013). 5.
Tae Ho Kim, Hyeong Jin Yun, and Chang-Koo Kim, ¡°Electroless Plating of
Co-Alloy Thin Films using Alkali-Free Chemicals¡±, Korean Chemical
Engineering Research, 45 (6), pp.633-637 (2007). 6.
Chang-Koo Kim, ¡° A Study on the Energy and Angular Distribution of Ions
Effusing from a Hole in Contact with a High Density Plasma¡±, Transport
Phenomena, 17 (1), pp.23-28 (2003). 7. Chang-Koo Kim, ¡°Introduction to Atomic Layer Etching¡±, Materials, 13 (2), pp.2-7 (2002).
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| Proceeding Volume
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1. Yil Wook Kim, Sang Ho Woo, Hai
Won Kim, Pyung Yong Um, Jung-Min Ji, and Chang-Koo Kim, ¡°Formation and
characterization of thin silicon dioxide films obtained by inductively-coupled
high-density plasmas using a dual rotated spiral antenna system¡±, ECS
Transactions, 25 (6), pp.173-178 (2009).
2. Sang Ho Woo, Yil Wook Kim,
Pyung Yong Um, Hai Won Kim, Sung Kil Cho, Hyung Su Choe, Dong Keu Lee, and
Chang-Koo Kim, ¡°Structural And
Morphological Properties of Nitrogen-Doped Polysilicon for Advanced Gate
Material¡±, ECS Transactions, 11 (4), pp.601-606 (2007).
3. Chang-Koo
Kim and Demetre J. Economou, ¡°Energy and Angular Distribution of Ions Extracted
from a Large Hole in contact with a High Density Plasma¡±, in Fundamental Gas-Phase and Surface Chemistry
of Vapor-Phase Deposition ¥±, Electrochem. Soc. Symp.
Proc. PV2001-13, edited by M. T. Swilhart, M. D. Allendorf, and M.
Meyyappan, pp.405-414 (2001).
4. Chan-Hwa
Chung, Chang-Koo Kim, and Sang Heup Moon, ¡°Monitoring of the Surface Species on
Silicon After Chemical Cleaning Cy FTIR Spectroscopy¡±, in Ultraclean Semiconductor Processing Technology and Surface Chemical
Cleaning and Passivation, Mat. Res. Soc. Symp. Proc. Vol. 386, edited by Michael Liehr, Marc Heyns, Masataka Hirose, and
Harold Parks, pp.291-296 (1995).
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